REQUIREMENTS FOR THE TRANSFER OF HEAT INTO A CONVENTION HEAT PLANT, INSIDE A CONVENTION PLANT

摘要

PCT No. PCT/EP94/04143 Sec. 371 Date Aug. 26, 1996 Sec. 102(e) Date Aug. 26, 1996 PCT Filed Dec. 14, 1994 PCT Pub. No. WO95/16537 PCT Pub. Date Jun. 22, 1995The present invention provides a heat-transfer device for use in a convective-heat installation, in particular in a convective soldering installation. A hollow body contains a heated fluid transferring heat via the wall of the hollow body to the soldering item. The advantages of the present invention reside in the fact that the maximum furnace temperature can be exactly adjusted, the dissipated heat is compensated for extremely quickly, the soldering items are treated carefully and the temperature of the system soldering item/soldering installation does not overshoot.