METHOD FOR ACCELERATING ELECTRONIC COMPONENT POOR PACKAGE RATE, AND METHOD FOR COMPARING ELECTRONIC COMPONENT POOR PACKAGE RATES

摘要

PROBLEM TO BE SOLVED: To provide a method for accelerating electronic component poor package rates for enabling a significant comparative test by intentionally accelerating the occurrence of poor packages, such as tombstones, and to provide a method for comparing electronic component poor package rates.;SOLUTION: Electronic component 2a, and a test board 1a wherein a plurality of land patterns 4 are formed each corresponding to one of the external electrodes 3 built at both ends of the electronic components 2a, are prepared. A conductive bonding material 5 is attached to each land pattern 4 and then the electronic components 2a are arranged, and the test board 1a is subjected to a reflow treatment. These steps are performed at least once, and a plurality of test pieces 9 are obtained, each different from the others concerning at least one out of the electronic component 2a, the land pattern 4, the constituents of the conductive bonding material 5, the position of the electronic component 2a as mounted, and the reflow conditions. A tombstoning rate is determined for each of the test pieces 9, and comparison is established.;COPYRIGHT: (C)2004,JPO&NCIPI