BONDING-WIRE REINFORCEMENT APPARATUS, METHOD OF REINFORCING BONDING WIRE, BONDING APPARATUS, RESIN-MOLD SEMICONDUCTOR DEVICE HAVING REINFORCED BONDING WIRE AND ITS MANUFACTURING APPARATUS

摘要

PPROBLEM TO BE SOLVED: To suppress deformation of wires after wire-bonding. PSOLUTION: The bonding-wire reinforcement apparatus 10 comprises a fine powder sprayer 40 for spraying two kinds of fine rein powder 62, 64, and a heater 70 for holding and heating a semiconductor device 80. The two kinds of fine powder 62, 64 are those that constitute a thermosetting resin of a so-called two-liquid type, and are melted and solidified by mixing at a prescribed temperature. The heater 70 is set to a temperature higher than the melting points of the two kinds of resin. The fine powder 62, 64 that are sprayed onto the semiconductor device 80 by the fine powder sprayer 40 is stuck on the upper faces of the wires 86, and mixed, melted, and solidified to form an insulating resin thin film on the upper faces of the wires to reinforce the wires 86. The fine powder may be stuck on whole faces of the wires by carrying the semiconductor device 80 into a fine powder suspended chamber having an atmosphere in which the fine powder is suspended. The bonding-wire reinforcement apparatus may be assembled in a wire-bonding apparatus. PCOPYRIGHT: (C)2005,JPO&NCIPI