METHOD OF DEPOSITING CONDUCTIVE GOLD FILM SUBSTITUTED FOR ELECTROLESS GOLD PLATING FILM USING CONDUCTIVE GOLD PASTE

摘要

PROBLEM TO BE SOLVED: To provide a method of easily depositing a conductive thin gold film which can be substituted for an electroless gold plating film utilized for various uses in an electronic industrial field and equivalent to that by an electroless flash gold plating method with high film thickness controllability and reproducibility.;SOLUTION: The surface of each gold hyperfine particle with a mean particle diameter of ≤100 nm is provided with a covering layer of an amine compound or the like capable of forming a coordinate bond with a gold element, and it is dispersed into an organic solvent. Using conductive gold paste with an organic acid anhydride, the derivative thereof or the like exhibiting reactivity with the amine compound or the like in the covering layer added, a coating film is deposited, and heat treatment is performed at ≤300°C, so that a thin gold film in which gold hyperfine particles are densely sintered is produced.;COPYRIGHT: (C)2004,JPO&NCIPI