RESIN MOLDED SHEET FOR CHIP FILLING, IC CHIP FILLED RESIN SHEET, METHOD FOR MANUFACTURING RESIN MOLDED SHEET FOR CHIP FILLING, AND METHOD FOR MANUFACTURING IC CHIP-FILLED RESIN SHEET

摘要

PPROBLEM TO BE SOLVED: To provide a resin sheet for chip filling and an IC chip-filled resin sheet which use a resin molded sheet to be suitably used for effectively filling it with IC chips, wherein the desired molded sheet with very high performance in dimensional accuracy is manufactured even when a material sheet is exposed in very harsh molding temperatures in the process of the material sheet being molded to the molded sheet, and also to provide a manufacturing method of the resin molded sheet for chip filling or the IC chip filled resin sheet. PSOLUTION: The resin molded sheet for chip filling is formed by molding the resin sheet whose stretching tension variables corresponding to thermal change of the stretching tension are 2.0 (kg/mmSP2/SP/50C) or less, or by molding a resin sheet consisting of polybutylene terephthalate or its modified body such that the resin sheet has recessed parts on its surface. Further, there are provided the IC chip filled resin sheet formed of the sheet filled with the IC chips, and the manufacturing method of the resin molded sheet for the chip filling or the manufacturing method of the IC chip filled resin sheet, which is characterized in that either method uses the resin molded sheet for the chip filling. PCOPYRIGHT: (C)2004,JPO