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Plantar pressure and shear stress reduction insole for diabetic foot ulceration

机译:减轻糖尿病足溃疡的足底压力和降低剪应力的鞋垫

摘要

The main purpose of this invention is to develop a new insole design which can significantly reduce the plantar pressure under the forefoot and heel, and can be used as replacement insole for the diabetic shoe, diabetic healing shoe, and removable cast walker. ;This new insole is consisting of shock absorbing and shear reducing composite layers of Poron or soft EVA for the bottom layer, Plastazote or cushioned polymer gel for the middle layer, and a closed cell Neoprene top cover. These materials are commercially available in sheets. ;The main advantage and uniqueness of this invention, comparing to other existing insoles, are the evenly spaced holes throughout the insole. The holes will significantly reduce the direct plantar pressure and shear stress dynamically exerting on the plantar skin upon loading. When there is a focal point of pressure, the holes will be distorted or stretched to the direction of the pressure which will also allow the insole material to distorted or “give” resulting in reduction of the peak plantar pressure and the associated shear stress. This will also eliminate any pressure transferring problems as encountered in other insoles. Removing the pressure will allow the insole material to return back to the original state. Therefore, dynamic direct plantar pressure and shear stress can be significantly reduced by these holes.
机译:本发明的主要目的是开发一种新的鞋垫设计,该设计可以显着降低前脚和脚跟下的足底压力,并且可以用作糖尿病鞋,糖尿病康复鞋和可移动式石膏助行器的替代鞋垫。 ;这种新的鞋垫由Poron或软EVA的减震减震复合材料层制成,底层为Plastazote或缓冲聚合物凝胶,中间层为闭孔氯丁橡胶顶盖。这些材料可以薄片形式商购。与其他现有的鞋垫相比,本发明的主要优点和独特性是贯穿整个鞋垫的均匀间隔的孔。这些孔将显着降低在加载时动态施加在足底皮肤上的直接足底压力和剪切应力。当存在压力焦点时,孔将变形或拉伸至压力方向,这也将使鞋垫材料变形或“屈服”。导致足底压力峰值和相关剪应力的降低。这也将消除其他鞋垫遇到的任何压力传递问题。消除压力将使鞋垫材料恢复到原始状态。因此,这些孔可显着降低动态直接足底压力和切应力。

著录项

  • 公开/公告号US2004168354A1

    专利类型

  • 公开/公告日2004-09-02

    原文格式PDF

  • 申请/专利权人 NGUYEN HIENVU CHUC;

    申请/专利号US20040762613

  • 发明设计人 HIENVU CHUC NGUYEN;

    申请日2004-01-23

  • 分类号A43B13/38;

  • 国家 US

  • 入库时间 2022-08-21 23:21:54

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