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Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same
Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same
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机译:简化设计规则的创新焊球垫结构,其制造方法和基板,电子设备组件以及采用该结构的系统
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摘要
A solder ball pad for mounting and connecting of electronic devices and, more particularly, apparatus and methods providing an improved solder ball pad structure on a substrate, such as a printed circuit board (“PCB”) or a semiconductor die, while enabling better use of the spaces between adjacent solder ball pads and at the same time providing increased surface area for bonding to a solder ball. More particularly, the inventive solder ball pad structure comprises a terminal pad exposed through an aperture in an insulative mask having a bond pad layer comprising at least another metal layer formed over, at most, a portion of the exposed portion of the terminal pad. Methods of manufacture and substrates incorporating same are also disclosed.
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