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Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system

机译：半导体设备在机器视觉系统中照明时表现出增强的模式识别能力

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摘要

A bumped semiconductor device (10) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps (16) and a coating of underfill material (17) on one face. A fluxing composition (18) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated (19) by selected wavelengths of light.

机译：凸起的半导体器件（ 10 ）在机器视觉系统中照明时表现出增强的模式识别能力。该半导体器件在一个面上具有基本上共面的焊料凸块（ 16 ）和底部填充材料（ 17 ）涂层。包含图像增强剂的助焊剂组合物（ 18 ）有选择地沉积在阵列中的至少两个焊料凸点上，以改变焊料凸点的光学特性，从而使焊料凸点看起来相对于当半导体器件被选定的光波长照射（ 19 ）时，底部填充材料的背景。 展开▼

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公开/公告号US6650022B1

专利类型

公开/公告日2003-11-18

原文格式PDF

申请/专利权人 MOTOROLA INC.;
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申请/专利号US20020241017

发明设计人 JANICE DANVIR;ROBERT DOOT;JING QI;NADIA YALA;PRASANNA KULKARNI;ZHAOJIN HAN;
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申请日2002-09-11

分类号H01L330/00;H01L297/60;

国家 US

入库时间 2022-08-21 23:13:46

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