首页>
外国专利>
BONDING FOR A MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND MEMS BASED DEVICES
BONDING FOR A MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND MEMS BASED DEVICES
展开▼
机译:微机电系统(MEMS)和基于MEMS的设备的绑定
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is bonded to a micro-machine chip using bonding materials. A layer of chromium is first deposited onto surfaces of the micro-machine and the micro-machine chip followed by a layer of gold. Subsequently, a layer of indium is deposited between the layers of gold, and the surface of the micro-machine is pressed against the surface of the micro machine chip forming a gold-indium alloy to serve as a bond between the micro-machine and the micro-machine chip. In addition, a cover is bonded to the micro-machine chip in the same manner providing a hermetic seal for the MEMS based device.
展开▼