ALUMINUM MATRIX COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY AND LOW THERMAL EXPANSIVITY FOR ELECTRONIC PACKAGING, AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: An aluminum matrix composite material with high thermal conductivity and low thermal expansion coefficient for electronic packagings is provided in which silicon carbide particles or silicon carbide and silicon particles are formed in aluminum matrix structure, and a manufacturing method thereof is provided. CONSTITUTION: The aluminum matrix composite material with high thermal conductivity and low thermal expansion coefficient for electronic packagings comprises matrix structure of aluminum, 40 to 60 vol.% of silicon carbide (SiC) particles and 10 to 20 vol.% of fine silicon (Si) particles between the silicon carbide (SiC) particles. The manufacturing method of the aluminum matrix composite material with high thermal conductivity and low thermal expansion coefficient for electronic packagings comprises the steps of mixing silicon carbide (SiC) particles having an average particles size of 20 micrometers with aluminum (Al) powder having an average particles size of 70 micrometers in a volume ratio of 40 to 60:60 to 40, or mixing silicon carbide (SiC) particles having an average particles size of 20 micrometers with aluminum-20silicon (Al-20Si) alloy powder having an average particles size of 45 micrometers in a volume ratio of 40 to 60:60 to 40; mechanically kneading the mixed powder; drying moisture contained in the kneaded mixed powder; plasma coating the dried mixed powder onto a target material; and cooling the coated target material.