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Polyimide Film For Flexible Printed Board and Flexible Printed Board Using the Same
Polyimide Film For Flexible Printed Board and Flexible Printed Board Using the Same
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机译:用于挠性印制板的聚酰亚胺膜和使用挠性印制板的挠性印制板
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摘要
The present invention provides a flexible printed circuit which is free from curl, torsion and warpage due to temperature change and excellent flexural endurance. By using polyimide film having an average coefficient of thermal expansion of 1.0x10SUP-5 /SUPto 2.5x10SUP-5 /SUPcm/cm/° C. in a temperature range of 100° C. to 200° C. and a stiffness value of 0.4 to 1.2 g/cm as the base film for the flexible printed circuit, a flexible printed circuit having excellent thermal dimensional stability and flexural endurance can be prepared.
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机译:本发明提供了一种柔性印刷电路,该柔性印刷电路没有由于温度变化而引起的卷曲,扭转和翘曲,并且具有优异的抗弯曲性。通过使用在100°C的温度范围内具有1.0x10 -5 SUP>到2.5x10 -5 SUP> cm / cm /°C的平均热膨胀系数的聚酰亚胺薄膜作为用于柔性印刷电路的基膜,在200℃至200℃的温度范围内和0.4至1.2g / cm的刚性值,可以制备具有优异的热尺寸稳定性和耐弯曲性的柔性印刷电路。
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