CURING COMPOUND CONTAINING AT LEAST ONE DOUBLE BOND, SILANE GROUP, ELECTRON DONATING GROUP AND ELECTRON ACCEPTING GROUP HAVING VOLATILITY LOWER THAN THAT OF COMMERCIAL SILANE PRODUCT

摘要

PURPOSE: Provided are a curing compound having a molecular weight sufficient for proving a volatility lower than that of a commercial silane product and a curing composition containing the curing compound. CONSTITUTION: The curing compound is represented by the formula, wherein Q is an oligomer group or a polymer group containing at least one C-C double bond; E is an electron donating or accepting group; R1 is a methyl group or an ethyl group; R2 is a C1-C4 linear or branched alkyl group, a vinyl group or an aromatic group; A is a hydrocarbon group; L is a linking group obtained by the reaction of a functional group except an epoxy group on the precursor to the segment containing silane and a functional group except an epoxy group on the precursor to the segment containing at least one C-C double bond; and n is 0, 1 or 2 simultaneously to each position.