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DICING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO PERFORM PRECISE DICING PROCESS FOR PARTIALLY DICING WAFER TO WHICH SUBSTRATE IS BONDED
DICING APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO PERFORM PRECISE DICING PROCESS FOR PARTIALLY DICING WAFER TO WHICH SUBSTRATE IS BONDED
PURPOSE: A dicing apparatus is provided to perform a precise dicing process for partially dicing a wafer to which a substrate is bonded by properly correcting the position of a rotation blade. CONSTITUTION: A wafer is mounted on a wafer stage(10). A blade(11) is disposed on the wafer stage. A light source irradiates detection light to the inside of a cutting groove which is formed in a dicing line region of the wafer by the blade. A recognition camera(15) detects the shape of the cutting groove based upon the reflection light from the cutting groove. A position correcting unit corrects the position of the blade based upon the detection result of the recognition camera so that the center line of the cutting groove is located in a predetermined position and the depth of the cutting groove becomes a predetermined value.
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