METHOD OF MANUFACTURING HIGH SILICON Al-Si ALLOY FOR ELECTRONIC PACKAGING MATERIAL BY VACUUM ARC MELTING METHOD AND HIGH SILICON Al-Si ALLOY FOR ELECTRONIC PACKAGING MATERIAL MANUFACTURED BY THE SAME

摘要

PURPOSE: A method for manufacturing high silicon Al-Si alloy for electronic packaging material more economically by applying a new process technology having simple process and low manufacturing cost compared with a conventional manufacturing method, and a high silicon Al-Si alloy for electronic packaging material manufactured by the same are provided. CONSTITUTION: The method comprises a step of preparing 30 to 50 wt.% of aluminum powder having purity of 99.9% and particle size corresponding to a sieve size of -325 mesh and 50 to 70 wt.% of silicon powder having purity of 99.9% and particle size corresponding to a sieve size of -200 mesh; a step of mixing the prepared powders at a mixing rate of 50 rpm for one hour using ball mill; and a step of obtaining an ingot by melting the mixed powder, wherein the melting step is performed by repeating the process of melting the mixed powder five times in a melting furnace by using a copper mold at pressure of 8x10¬-8 torr and arc current of 130 amperes, wherein the melting step is performed at an inert gas atmosphere, and wherein 29.9 to 45 wt.% of aluminum powder and 0.1 to 5 wt.% of rare earth element as third element for molding are added in the powder preparation step. The high silicon Al-Si alloy for electronic packaging material comprises 30 to 50 wt.% of aluminum and 50 to 70 wt.% of silicon, wherein aluminum content is 29.9 to 45 wt.%, and the high silicon Al-Si alloy further comprises 0.1 to 5 wt.% of rare earth element.