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1995, And systems for measuring the micro - roughness of a substrate, combining the measurements of the counter of the particles and has an atomic force microscope
1995, And systems for measuring the micro - roughness of a substrate, combining the measurements of the counter of the particles and has an atomic force microscope
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机译:1995年,以及用于测量基材微粗糙度的系统,结合了粒子计数器的测量并具有原子力显微镜
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摘要
Embodiments of the present invention provide methods for measuring a wafer surface. A portion of the wafer surface is measured using a particle counter to provide first measurements corresponding to a plurality of points on the wafer surface. A selected area of the wafer surface including one of the plurality of points is measured using an atomic force microscope (AFM) to provide a microroughness measurement of the selected area. The selected area is a localized area of the portion of the wafer surface measured using the particle counter. The first measurements and the microroughness measurement are provided as a measurement of the wafer surface. The portion measured using a particle counter may, for example, be substantially the entire wafer surface.
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