PREPARATION PROCESS OF PREPREG, METAL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg, a resin composition containing no halogen-based compound, excellent in heat resistance, flame retardancy and dielectric characteristics, and also to provide a metal-clad laminated plate and a printed circuit board.;SOLUTION: The resin composition contains the following materials as essential components:(a) a phosphorus flame retardant containing 20-30 wt.% of phosphorus, (b) a polyphenylene ether resin having a number average molecular weight of 1,000-4,000, (c) a thermosetting resin containing no halogen and (d) a curing agent for the above thermosetting resin.;COPYRIGHT: (C)2005,JPO&NCIPI