CERAMIC SUBSTRATE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a ceramic substrate and a method of manufacturing a semiconductor device, in which the ceramic substrate on which a plurality of semiconductor chips are mounted and sealed by a resin, is diced with a recognition mark as a reference and the center of a dicing groove can be made to coincide with the center of a dividing groove.;SOLUTION: In a ceramic substrate on which a plurality of semiconductor chips are mounted and a resin-sealing body for covering the semiconductor chips is formed on the principal surface, there are provided a split groove 2 which is formed on the principal surface of the ceramic substrate 1, for dividing the ceramic substrate for each semiconductor chip and a recognition mark 3 used to dice only the resin sealing body, before splitting the ceramic substrate. The split groove is formed on the recognition mark so as to divide the recognition mark into pieces. Since the recognition mark, having a fixed width is present right near both sides of the split groove without fail, dicing with the recognition mark as a reference easily makes the center of the dicing groove of the resin-sealing body coinciding with the center of the split groove on the ceramic substrate, thereby stabilizing the shape after splitting.;COPYRIGHT: (C)2006,JPO&NCIPI