首页> 外国专利> FIB DEVICE FOR TEM SAMPLE PROCESSING EQUIPPED WITH FUNCTION FOR AUTOMATICALLY RECOGNIZING BENDING

FIB DEVICE FOR TEM SAMPLE PROCESSING EQUIPPED WITH FUNCTION FOR AUTOMATICALLY RECOGNIZING BENDING

机译:配备有用于自动识别弯曲的功能的TEM样品处理的光纤设备

摘要

PROBLEM TO BE SOLVED: To provide a technology capable of TEM sample automatic finishing by being equipped with a function for recognizing automatically a bending phenomenon generated in TEM sample processing by an FIB device.;SOLUTION: In a bending automatic recognition method in the TEM sample processing, secondary electron detection is performed by a secondary charged particle detector at a thinning time of the TEM sample, and the sample is determined to be bent when detecting a sudden change in a detection signal. In a TEM sample processing method, the secondary electron detection is performed by the secondary charged particle detector at the thinning time of the TEM sample, and the sample is determined to be bent when detecting the sudden change in the detection signal, and thinning is discontinued. Cutting by the FIB is performed to straighten the bending, and thinning is proceeded in this state.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种能够自动识别通过FIB设备在TEM样品处理过程中产生的弯曲现象的功能的TEM样品自动精加工技术;解决方案:在TEM样品中的弯曲自动识别方法中在TEM处理中,通过二次带电粒子检测器在TEM样品的稀薄时间进行二次电子检测,并且在检测到检测信号的突然变化时确定样品弯曲。在TEM样品处理方法中,二次电子检测是在TEM样品稀化时由二次带电粒子检测器进行的,当检测到检测信号的突变时,样品被确定为弯曲,并且不再进行稀化。 。通过FIB进行切割以使弯曲变直,并在此状态下进行薄化。;版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2004361138A

    专利类型

  • 公开/公告日2004-12-24

    原文格式PDF

  • 申请/专利权人 SII NANOTECHNOLOGY INC;

    申请/专利号JP20030157119

  • 发明设计人 ICHINOMIYA YUTAKA;IWASAKI KOJI;

    申请日2003-06-02

  • 分类号G01N1/28;G01N1/32;H01J37/30;H01J37/317;

  • 国家 JP

  • 入库时间 2022-08-21 22:29:44

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