首页> 外国专利> Apparatus and method for inspecting interface between ground layer and substrate of microstrip by using scattering parameters

Apparatus and method for inspecting interface between ground layer and substrate of microstrip by using scattering parameters

机译:利用散射参数检查微带接地层与衬底之间界面的装置和方法

摘要

An apparatus and method for detecting a defect on a ground layer of microstrip by using scattering parameters is disclosed. The apparatus includes: a providing unit for providing a signal to the microstrip by changing a frequency of the signal in a predetermined range of frequencies; a detecting unit for detecting scattering parameters of an output signal from the microstrip in response to the frequency of the signal; and an analyzing unit for analyzing the interface based on the scattering parameters.
机译:公开了一种通过使用散射参数来检测微带接地层上的缺陷的设备和方法。该设备包括:提供单元,用于通过在预定频率范围内改变信号的频率来将信号提供给微带;以及检测单元,用于响应信号的频率,检测微带输出信号的散射参数;分析单元,用于基于散射参数分析界面。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号