首页> 外国专利> Fabrication method of an epilayer structure InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency

Fabrication method of an epilayer structure InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency

机译:高相位调制效率的外延层结构InGaAsP / InP脊形波导相位调制器的制备方法

摘要

The present invention relates to a fabrication method of an epilayer structure for InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency. In more detail, it relates to a P-p-n-N InGaAsP/InP ridge waveguide phase modulator fabricated to be that the phase change of the TE-mode is linearly proportional to the reverse bias voltage at 1.55 μm wavelength. ;The present invention presents a method for fabricating an epilayer structure for achieving the optical confinement in the vertical direction of an InGaAsP/InP waveguide phase modulator, characterized by comprising the steps of: forming a first cladding layer of N-InP on an N+-InP substrate; forming a first waveguide layer of n-InGaAsP and a second waveguide layer of p-InGaAsP in sequence on the first cladding layer; forming a second cladding layer of P-InP and a third cladding layer of P-InP in sequence on the second waveguide layer; and forming an electrode layer of p+-InGaAs on the third cladding layer.
机译:本发明涉及具有高相位调制效率的用于InGaAsP / InP脊形波导相位调制器的外延层结构的制造方法。更详细地,本发明涉及一种P-p-n-N InGaAsP / InP脊形波导相位调制器,其被制造为使得TE模式的相变与1.55μm波长处的反向偏置电压成线性比例。本发明提出了一种用于在InGaAsP / InP波导相位调制器的垂直方向上实现光限制的外延层结构的制造方法,其特征在于包括以下步骤:在N < Sup> + -InP底物;在第一包层上依次形成n-InGaAsP的第一波导层和p-InGaAsP的第二波导层;在第二波导层上依次形成P-InP的第二包层和P-InP的第三包层;在第三包层上形成p + -InGaAs电极层。

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