METAL BOUND FLEXIBLE LAMINATE USING LOW PERMITTIVITY POLYIMIDE AND FLEXIBLE RIGID METAL BOUND LAMINATE USED IN ELECTRIC AND/OR ELECTRONIC APPLICATIONS

摘要

PURPOSE: Provided are a flexible metal bound laminate and a flexible rigid metal bound laminate using low permittivity polyimide with superior thermal-resistance and an adhesiveness useable in various applications such as print circuit board, side heating material, electromagnetic wave shield material, flat cable, etc. CONSTITUTION: The flexible metal thin film adhesive laminate comprises at least one polyimide layer composed of polyimide having repeating unit represented by formula I (wherein R is tetra-valent group derived from cyclohexane and pi is binary valent aliphatic, alicyclic, aromatic group or a combination thereof) and at least one metal layer. The polyimide is solvent-soluble and has improved thermal-resistance and adhesiveness, as well as low dielectric property, that is, permittivity at high-frequency range.