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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING ANNEALING ON SEMICONDUCTOR SUBSTRATE WITH LARGE AND SMALL MASS IONS

机译:在大质量和小质量离子的半导体衬底上退火制造半导体器件的方法

摘要

PURPOSE: A method of manufacturing a semiconductor device is provided to restrain TED(Transient Enhanced Diffusion), to increase the activation ratio of implanted ions and to prevent the damage of a semiconductor substrate by performing annealing after mixing large mass ions with small mass ions. CONSTITUTION: A tunnel oxide layer(16), a floating gate electrode(18), a dielectric film(20) and a control gate electrode(22) are sequentially formed on a semiconductor substrate(10). A first ion-implantation of large mass ions is performed on the resultant structure by using the control gate electrode as a mask. A source and drain region(26) are formed in the substrate by performing a second ion-implantation on the resultant structure using small mass ions. Annealing is performed thereon.
机译:目的:提供一种制造半导体器件的方法,以通过在将大质量离子与小质量离子混合之后进行退火来抑制TED(瞬态增强扩散),提高注入离子的活化率并防止半导体衬底的损坏。构成:在半导体衬底(10)上依次形成隧道氧化层(16),浮栅电极(18),介电膜(20)和控制栅电极(22)。通过使用控制栅电极作为掩模,在所得结构上进行大质量离子的第一离子注入。通过使用小质量离子在所得结构上进行第二次离子注入,在衬底中形成源区和漏区(26)。在其上进行退火。

著录项

  • 公开/公告号KR20050002249A

    专利类型

  • 公开/公告日2005-01-07

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20030043618

  • 发明设计人 KWAK NOH YEAL;

    申请日2003-06-30

  • 分类号H01L21/322;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:05

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