首页> 外国专利> SEMICONDUCTOR MEMORY DEVICE WITH MULTI-FUNCTIONAL PAD CAPABLE OF IMPROVING COMPATIBILITY WITH VARIOUS PACKAGE TYPES AND METHOD OF ARRANGING MULTI-FUNCTIONAL PAD

SEMICONDUCTOR MEMORY DEVICE WITH MULTI-FUNCTIONAL PAD CAPABLE OF IMPROVING COMPATIBILITY WITH VARIOUS PACKAGE TYPES AND METHOD OF ARRANGING MULTI-FUNCTIONAL PAD

机译:具有能够提高各种包装类型的兼容性的多功能垫的半导体存储器和布置多功能垫的方法

摘要

Purpose: it is arranged to improve the compatibility with various monoblock types with multi-functional pad and a kind of semiconductor storage device for the method for multi-functional pad to be arranged. Construction: semiconductor storage device includes the pad of chip, an input/output circuitry, signal lines, an option coupling part. The pad of chip with different sizes is spaced-apart on a chip. Input/output circuitry (20) is connect with the pad of chip. Signal lines (10,6) are connect with the pad of chip. Option coupling part (8) is used to be selectively connectable with the pad of the chip of input/output circuitry or the signal lines for the monoblock type for being applied to chip according to one.
机译:目的:被布置为改善与具有多功能垫的各种单体类型的兼容性,以及一种用于布置多功能垫的方法的半导体存储装置。结构:半导体存储设备包括芯片焊盘,输入/输出电路,信号线,选件耦合部分。具有不同尺寸的芯片焊盘在芯片上间隔开。输入/输出电路(20)与芯片焊盘连接。信号线(10,6)与芯片焊盘相连。选项耦合部件(8)用于选择性地与输入/输出电路的芯片的焊盘或用于整体式的信号线(根据一种应用于芯片)选择性地连接。

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