Forming thermally conducting connection between semiconducting module heat dissipation surface and cooling element, involves placing heat-conducting paste between heat dissipation surface and cooling element

摘要

The method involves placing heat-conducting paste (6) between the heat dissipation surface (2) and the cooling element (3), whereby a number of. heat-conducting paste fields are arranged in a defined raster structure on the heat dissipation surface and/or cooling element and are united to form a heat-conducting paste layer when the module (1) and cooling body are assembled. An independent claim is also included for a unit with a thermally conducting connection between a heat dissipation surface of a power semiconducting module and a cooling element.