Filling contact holes in dielectric layer on substrate, comprises removing impurities from hole walls, gassing out residues, applying adhesive layer, and filling with metal compound

摘要

Filling contact holes (2) in a dielectric layer (3) on a substrate, with a metal compound, comprises removing impurities from the walls of the holes, gassing out residues at high temperature, and then applying an adhesive layer (4) onto the dielectric surface. The filling (1) is applied to the adhesive layer, so the hole is completely filled The adhesive layer comprises TiN or Ti/TiN.