Twin-mask lithography for a substrate surface coated with a photo varnish, to form an electronic integrated circuit, has light shrouding main and auxiliary structures which are used with illumination

摘要

A twin-mask process is used to structure a substrate surface with a photo varnish coating by lithography, for an integrated electronic circuit. The coating is illuminated using the first mask with a light shrouding main structure (2) and an auxiliary structure (3). The main structure is formed on the varnish, with the auxiliary structure used to support the accuracy of the image. The varnish is again illuminated with the second mask with transparent zones (4), to form further structures on the varnish, without light falling on the main structure. The structures are positioned with given gaps (A,B,D) between them.