Silicon block cutting method for use in e.g. electronic field, involves holding block in cut area after block is cut, such that individual slices are firmly clamped on opposite sides by membrane, and releasing portion of un-cut block

摘要

The method involves holding a silicon block (1) opposite to an area where a wire saw acts. The block is held in the cut area after the block is cut over its thickness, such that individual slices are clamped on opposite sides in the direction right angle to direction of cut by a fluid-operated membrane. The portion of the block that is not yet cut is released from a clamp, so that the block is cut into slices over its entire thickness. An independent claim is also included for a device for cutting a block into thin slices using a wire saw.