首页> 外国专利> Toxic gas pumping and treating system for use in semiconductor fabrication industry, has pumped gas treatment system with plasma sources for generating plasma that decomposes partly some gas traversing pumping assembly

Toxic gas pumping and treating system for use in semiconductor fabrication industry, has pumped gas treatment system with plasma sources for generating plasma that decomposes partly some gas traversing pumping assembly

机译:用于半导体制造行业的有毒气体泵送和处理系统,具有带等离子体源的泵送气体处理系统,用于产生等离子体,该等离子体可部分分解一些横越气体的泵送组件

摘要

The system includes a pumping assembly (2) with a vacuum pump body having multiple pumping stages (5-9), and a pumped gas treatment system. The pumped gas treatment system has plasma sources (15, 16) housed inside the vacuum pump body of the pumping assembly for generating plasma that decomposes partly some gas traversing the pumping assembly.
机译:该系统包括具有具有多个泵送级(5-9)的真空泵体的泵送组件(2),以及泵送的气体处理系统。抽气处理系统具有容纳在抽气组件的真空泵体内的等离子体源(15、16),用于产生等离子体,该等离子体部分分解穿过抽气组件的一些气体。

著录项

  • 公开/公告号FR2863103A1

    专利类型

  • 公开/公告日2005-06-03

    原文格式PDF

  • 申请/专利权人 ALCATEL;

    申请/专利号FR20030014176

  • 申请日2003-12-01

  • 分类号H01J37/32;H05H1/24;

  • 国家 FR

  • 入库时间 2022-08-21 21:58:18

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