首页> 外国专利> SUBSTRATE FOR FORMATION OF (111)-ORIENTED PZT-TYPE DIELECTRIC FILM AND (111)-ORIENTED PZT-TYPE DIELECTRIC FILM FORMED BY USING THE SUBSTRATE

SUBSTRATE FOR FORMATION OF (111)-ORIENTED PZT-TYPE DIELECTRIC FILM AND (111)-ORIENTED PZT-TYPE DIELECTRIC FILM FORMED BY USING THE SUBSTRATE

机译:通过使用该基质形成的形成(111)取向的PZT型介电薄膜和(111)取向的PZT型介电薄膜的基质

摘要

PROBLEM TO BE SOLVED: To provide a substrate for the formation of a (111)-oriented PZT-type dielectric film capable of forming on a silicon substrate a (111)-oriented PZT-type dielectric film with a high purity and no compositional discrepancy by application of the least necessary quantity of heat, to provide a high-purity (111)-oriented PZT-type dielectric film obtained by utilizing such substrate, and to provide a method for producing a high-purity (111)-oriented PZT-type dielectric film by utilizing such substrate.;SOLUTION: The substrate for the formation of the (111)-oriented PZT-type dielectric film is one obtained by heat-treating a substrate material composed of a silicon substrate and a titanium film and a platinum film successively formed thereon, wherein an orientation control layer containing titanium oxide is formed on the platinum film. The (111)-oriented PZT-type dielectric film is obtained by utilizing the substrate.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种用于形成(111)取向的PZT型介电膜的基板,该基板能够在硅基板上形成高纯度且无组成差异的(111)取向的PZT型介电膜。通过施加最少的热量,提供通过使用这种基板获得的高纯度(111)取向的PZT型介电膜,并提供一种生产高纯度(111)取向的PZT-介电膜的方法解决方案:解决方案:用于形成(111)取向PZT型介电膜的基板是通过对由硅基板,钛膜和铂组成的基板材料进行热处理而获得的基板。在其上连续形成的膜上,其中在铂膜上形成包含氧化钛的取向控制层。 (111)取向的PZT型介电膜是通过利用基板获得的。;版权所有:(C)2006,JPO&NCIPI

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