Vis-a-vis 'the contact electrode of each 1 pair of the upper circuit laying film' 'upper circuit and the lower part circuit, IC infrastructure' empty in order controls the electric information the urethane foam and the like which locks the spacer film' 'lower part circuit laying film' 'each film for insulating which the space of electrification in order for the electrode to guarantee contact multiple is gained by core material' 'electrification and to send to the computer itself the large-sized keyboard which at the waterproof film laminates the structure which is formed.

摘要

SolutionsIC infrastructure in order the spacer film 5 for insulating which the space for electrification in order to guarantee the contact of the electrode array of each manipulation key, the upper circuit laying film 3 which has the springiness which prints the upper circuit for electrification respectively on back' 'vis-a-vis the contact electrode of each 1 pair of the upper circuit and the lower part circuit 'on the surface, multiple is gained' 'the lower part circuit laying film 8 which prints the lower part circuit for electrification on the surface' 'it locks each film and the urethane foaming board 10 which is made the core material of the computer' 'controls the electric information by electrification and to send to the computer itself' the emptyThe keyboard which at waterproof film 11 laminates the structure which is formed. Advantages Restriction is not received to size in inside the print technical possible range, with super thin shape super light weight, furthermore when manipulating the waterproof dustproof keyboard which does not send sound can be offered to the market low at cost. Choice figure Drawing 13