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Copper foil for printed circuit board with taking environmental conservation into consideration

机译:兼顾环保的印刷电路板铜箔

摘要

A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of copper or copper alloy, and the rust preventing layer contains 0.5 to 2.5 μg/cm2 of chromium converted into metallic chromium.
机译:用于印刷电路板的铜箔具有通过三价铬化学转化处理在铜箔的表面上形成的防锈层,该铜箔结合到用于印刷电路板的基材上。 T铜箔是铜或铜合金的,防锈层包含0.5到2.5μg/ cm 2 的铬,这些铬转化为金属铬。

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