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METHOD AND DEVICE FOR SEPARATING PRODUCTS, MOUNTED ON A COMMON SUBSTRATE, FROM EACH OTHER ALONG (A) CUTTING LINE(S)
METHOD AND DEVICE FOR SEPARATING PRODUCTS, MOUNTED ON A COMMON SUBSTRATE, FROM EACH OTHER ALONG (A) CUTTING LINE(S)
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机译:用于分离安装在公用基材上的产品和从切割线中分离出来的方法和装置
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摘要
THE INVENTION RELATES TO A METHOD AND A DEVICE FOR SEPARATING PRODUCTS (3) MOUNTED ON A COMMON SUBSTRATE (1), FROM EACH OTHER, ALONG (A) CUTTING LINE (S) (6,7). THE PRODUCTS (3) EACH COMPRISE ONE OR MORE CHIPS PRESENT ON SAID SUBSTRATE (1) AND CONNECTING MEANS CONNECTED THERETO, THE CONNECTING ENDS REMOTE FROM THE CHIP OF WHICH ARE PROVIDED WITH SOLDER BALLS (5) BONDED THERTO. THE PRODUCTS (3) ARE CLAMPED DOWN ON A SUPPORTING ELEMENT(17) BY USING A SUB-ATMOSPHERIC PRESSURE, AND THE SUPPORTING ELEMENT (17) AND A ROTARY CUTTING BLADE (10) ARE MOVED RELATIVE TO EACH OTHER ALONG THE INTENDED CUTTING LINE (6,7) SO AS TO CUT THROUGH THE SUBSTRATE (1). A LIQUID IS SUPPLIED AT THE LOCATION OF SAID CUTTING LINE (6,7) ON EITHER SIDE OF THE SUBSTRATE (1).(FIG 7 AND 8).
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