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METHOD AND DEVICE FOR SEPARATING PRODUCTS, MOUNTED ON A COMMON SUBSTRATE, FROM EACH OTHER ALONG (A) CUTTING LINE(S)

机译:用于分离安装在公用基材上的产品和从切割线中分离出来的方法和装置

摘要

THE INVENTION RELATES TO A METHOD AND A DEVICE FOR SEPARATING PRODUCTS (3) MOUNTED ON A COMMON SUBSTRATE (1), FROM EACH OTHER, ALONG (A) CUTTING LINE (S) (6,7). THE PRODUCTS (3) EACH COMPRISE ONE OR MORE CHIPS PRESENT ON SAID SUBSTRATE (1) AND CONNECTING MEANS CONNECTED THERETO, THE CONNECTING ENDS REMOTE FROM THE CHIP OF WHICH ARE PROVIDED WITH SOLDER BALLS (5) BONDED THERTO. THE PRODUCTS (3) ARE CLAMPED DOWN ON A SUPPORTING ELEMENT(17) BY USING A SUB-ATMOSPHERIC PRESSURE, AND THE SUPPORTING ELEMENT (17) AND A ROTARY CUTTING BLADE (10) ARE MOVED RELATIVE TO EACH OTHER ALONG THE INTENDED CUTTING LINE (6,7) SO AS TO CUT THROUGH THE SUBSTRATE (1). A LIQUID IS SUPPLIED AT THE LOCATION OF SAID CUTTING LINE (6,7) ON EITHER SIDE OF THE SUBSTRATE (1).(FIG 7 AND 8).
机译:本发明涉及一种用于将产品(3)与(A)切割线(6,7)中的每个彼此分离的产品(3)分离的方法和装置。产品(3)包含一个或多个上述基片(1)上的芯片,并与之相连的连接装置是指与之相连的,不带芯片的连接端(5)由粘结的锡球组成。通过使用亚大气压将产品(3)固定在一个支撑元件(17)上,并且将支撑元件(17)和一个旋转切割刀片(10)相对于其他预定切割线( 6,7)以便切穿基材(1)。在基质(1)的另一侧的所述切割线(6,7)处提供液体(图7和8)。

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