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GOLD ALLOY THIN WIRE AND GOLD ALLOY BUMP

机译:金合金薄线和金合金凸块

摘要

TO PROVIDE A GOLD ALLOY THIN WIRE AND A BUMP FORMED THEREFROM WITH A SMALL NECK LENGTH STABLY OBTAINED UPON THE WIRE BREAKAGE AFTER BALL BONDING, A GOLD ALLOY THIN WIRE CONTAINS 0.2 TO 5000 PPM BY WEIGHT OF SI AND THE BALANCE OF GOLD AND UNAVOIDABLE IMPURITIES. THE WIRE MAY FURTHER CONTAINES, OTHER THAN SI, A TOTAL AMOUNT OF 0.2 TO 300 PPM BY WEIGHT OF AT LEAST ONE FROM THE FIRST GROUP OF CA, BE, LA, AND CE; OR A TOTAL AMOUNT OF 1 TO 500 PPM BY WEIGHT OF AT LEAST ONE FROM THE SECOND GROUP OF Y, SC, SR, GA, GE, AND IN; OR A TOTAL AMOUNT OF 2 TO 10000 PPM BY WEIGHT OF AT LEAST ONE FROM THE THIRD GROUP OF CU, PD, PT, A1, AND MN.FIGURE 3.
机译:要提供金合金薄线和凹凸不平的锻造补铁,并在焊球断裂后稳定地获得小颈长,则金合金薄线的重量为SI时为0.2至5000 PPM,并且金和不平衡的金的平衡。除SI以外,该电线还可能包含来自CA,BE,LA和CE的第一组的总重量至少为0.2到300 PPM的总量;或从第二组Y,SC,SR,GA,GE和IN中获得的总重量至少为1到500 PPM;或从第三组CU,PD,PT,A1和MN中减去至少1重量后总计2到10000 PPM的量图3。

著录项

  • 公开/公告号MY126628A

    专利类型

  • 公开/公告日2006-10-31

    原文格式PDF

  • 申请/专利权人

    申请/专利号MYPI 96001016

  • 发明设计人 KOHEI TATSUMI;TOMOHIRO UNO;

    申请日1996-03-20

  • 分类号C22C5/02;

  • 国家 MY

  • 入库时间 2022-08-21 21:37:14

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