TFT SUBSTRATE AND PRODUCTION METHOD THEREFOR, AND TRANSPARENT CONDUCTIVE FILM LAMINATE SUBSTRATE PROVIDED WITH Al WIRING AND PRODUCTION METHOD THEREFOR, AND TRANSPARENT CONDUCTIVE FILM LAMINATE CIRCUIT BOARD PROVIDED WITH Al WIRING AND PRODUCTION METHOD THEREFOR, AND OXIDE TRANSPARENT CONDUCTIVE FILM MATERIAL

摘要

A method of producing a laminate circuit board provided with an Al wiring is simplified by using as a transparent conductive film a transparent conductive material containing specific metals. A transparent conductive film laminate circuit board provided with an Al wiring, comprising a transparent substrate (1), an Al wiring (7) provided on the transparent substrate (1) and consisting of Al or Al alloy, and a conductive oxide mainly containing indium oxide-zinc oxide-tin oxide, characterized in that the board contains a transparent conductive film (9) directly joined with the Al wiring (7). The direct joining of the Al wiring (7) with the transparent conductive film (9) with no barrier metal between them can simplify a production process. The use of a specific-component conductive oxide can reduce a contact resistance to a low level despite the direct joining with the Al wiring (7).