APPARATUS FOR SANDING PROBE TIPS USED FOR SEMICONDUCTOR DEVICES TEST AND MEHTOD FOR SANDING PROBE TIPS USING THE SAME

摘要

The present invention provides a semiconductor device test probes to be used effectively to remove any debris that has accumulated on the probe tip relates to a grinding method using the grinding apparatus and it's tip, the probe tip and the test head for fixing the probe card are provided, and the probe station which is the object to the probe tip is placed in contact, towards the object is placed in the probe station by using a grinding apparatus of the probe tip comprises an ultrasonic generator for generating ultrasonic waves by using the DLC wafer with ultrasound for sanding characterized by grinding the probe tip. According to the invention, into the DLC during wafer grinding cycle it is possible to remove foreign matter that has accumulated on the probe tip, the probe tip by grinding effectively. Thus, the increase in contact resistance due to foreign matter that has accumulated on the probe tip, the open accident, there is an effect that solve problems such as distortion of the electrical signal.