首页> 外国专利> THICK-FILM CAPACITORS, EMBEDDING THICK-FILM CAPACITORS INSIDE PRINTED CIRCUIT BOARDS, AND METHODS OF FORMING SUCH CAPACITORS AND PRINTED CIRCUIT BOARDS

THICK-FILM CAPACITORS, EMBEDDING THICK-FILM CAPACITORS INSIDE PRINTED CIRCUIT BOARDS, AND METHODS OF FORMING SUCH CAPACITORS AND PRINTED CIRCUIT BOARDS

机译:厚膜电容器,在印刷电路板内嵌入厚膜电容器,以及形成这种电容器和印刷电路板的方法

摘要

A method of embedding thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from coming in contact with and damaging the capacitor layers.
机译:嵌入厚膜电容器的方法包括在蚀刻之前用保护涂层覆盖电容器层,以防止蚀刻溶液与电容器层接触并损坏电容器层。

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