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FACED TARGET SPUTTERING DEVICE AND METHOD OF FABRICATING OLED BY USING THE SAME
FACED TARGET SPUTTERING DEVICE AND METHOD OF FABRICATING OLED BY USING THE SAME
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机译:面状目标溅射装置及使用该方法制造OLED的方法
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摘要
The present invention is by using a target of the opposite disk-shaped, particles having high energy are generated when forming the thin film and prevent damage to the film due to the collision of the substrate, by forming a thin layer by a number of revolution of the substrate opposite to the periphery of the target of the original plate, according to the production method of an organic light emitting display device using the sputtering device suitable for mass production, and this that, with the present invention the opposing target type sputtering apparatus that make up the body of the chamber, the chamber having a substrate mount for mounting a plurality of substrates along the inner wall of the chamber, are oppositely disposed with a predetermined distance to space constraint and a pair of opposing sputtering target for forming the one installed on each of the rear pair of the target is achieved by having a magnetic field generating means for generating a magnetic field to the space constraint.
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