Test-burn-in apparatus, in-line system using the test-burn-in apparatus and test method using the system

摘要

A test and burn-in apparatus for semiconductor chip package devices, an in-line system which includes the test and burn-in apparatus, and a test method which employs the in-line system are provided. A test and burn-in apparatus for testing semiconductor devices allows various testing processes, including a burn-in process, to be performed at the same testing stage. The apparatus employs test trays which contain the semiconductor devices. These test trays are used throughout the in-line system so that an entire back-end process can be performed without the need for loading/unloading the semiconductor devices into and from device trays between the various tests. The test and burn-in apparatus according to this invention can therefore occupy less space than the prior art testing apparatuses. The in-line system includes multiple test and burn-in apparatuses as well as a single sorting unit which performs a composite sorting operation after all the testing processes have been performed. Furthermore, the method for testing the semiconductor devices in the in-line system includes testing the semiconductor devices in the test trays using the test and burn-in apparatus, generating a test tray map corresponding to results of the test, transferring the test trays to a different testing apparatus for a second testing and test tray map generation process, and finally sorting the semiconductor devices in the sorting unit after all testing processes have been performed based on a final sorting map created by combining the test tray maps of each of the tests. The benefits of this invention are reduced time and space requirements because neither transferring the devices to device trays between tests nor performing multiple sorting steps are required.