SYSTEM AND METHOD FOR HEATING, COOLING AND thermocycling in the microfluidic device

摘要

1.u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device with integrated system u0442u0435u0440u043cu043eu0446u0438u043au043bu0438u0440u043eu0432u0430u043du0438u00a0, u0441u043eu0434u0435u0440u0436u0430u0449u0430u00a0 u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device having a first plate and a second plate, and the p u0435u0440u0432u0430u00a0 plate has a first surface and a second surface, and in which the first surface of the u0442u0440u0430u043du0441u043fu043eu0440u0442u0438u0440u043eu0432u0430u043du0438u00a0 are fluid, with u0432u0442u043eu0440u0430u00a0 plas tina has internal side and external side.with the u0432u043du0443u0442u0440u0435u043du043du00a0u00a0 side second plate is adjacent the first surface of the first plate; and at least one container attached to the outside of the u0440u0445u043du043eu0441u0442u0438 and u043du0430u0445u043eu0434u00a0u0449u0443u044eu0441u00a0 in thermal contact with a portion of the coolant, resulting in a temperature of fluid in the circuit u0432u043bu0438u00a0u0435u0442 temperature receptacle, the receptacle also the intake port includes a hole.;2. u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device 1, in which container also includes u0441u0435u0431u00a0 u0441u043eu0434u0435u0440u0436u0430u0449u0438u0439u0441u00a0 in her u044du043au0437u043eu0442u0435u0440u043cu0438u0447u0435u0441u043au0438u0439 material, with the opening of the inlet port and etc. u0438u0432u043eu0434u0438u0442 the u044du043au0437u043eu0442u0435u0440u043cu0438u0447u0435u0441u043au0438u0439 material and initiate the change in temperature in the tank and in a part of the coolant in thermal contact with the receptacle.;3. u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device 1, in which container also includes u0441u0435u0431u00a0 u0441u043eu0434u0435u0440u0436u0430u0449u0438u0439u0441u00a0 in her u044du043du0434u043eu0442u0435u0440u043cu0438u0447u0435u0441u043au0438u0439 material, with the opening of the inlet port and etc. u0438u0432u043eu0434u0438u0442 the u044du043au0437u043eu0442u0435u0440u043cu0438u0447u0435u0441u043au0438u0439 material and initiate the change in temperature in the tank and in a part of the coolant in thermal contact with the receptacle.;4. u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device 1, which also contains at least two tank installed on the outer surface of the u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0433u043e device with it u043fu0435u0440u0432u0430u00a0 u043du0430u0445u043eu0434u0438u0442u0441u00a0 reservoir in thermal contact with the first part of the contour, and u0432u0442u043eu0440u0430u00a0 u043du0430u0445u043eu0434u0438u0442u0441u00a0 reservoir in thermal contact with the second part of the figure.;5. u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device 1, which also contains three tanks installed on the outer surface of the u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0433u043e device, with three tanks u043fu043eu0432u044bu0448 u0430u044eu0442 u043du0430u0445u043eu0434u00a0u0449u0438u0445u0441u00a0 temperature in thermal u043fu0440u0438u043cu044bu043au0430u043du0438u0438 parts contour to the temperatures required u0434u043bu00a0 u0437u0430u0432u0435u0440u0448u0435u043du0438u00a0 with an r.l.f.t.... (pcr).;6. u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device 1, which is also u0432u043eu0437u0434u0443u0445u043eu043du0435u043fu0440u043eu043du0438u0446u0430u0435u043cu043eu0435 density on the inlet port of the tank.;7. u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device 1, which is portable.;8.u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device with integrated system u0442u0435u0440u043cu043eu0446u0438u043au043bu0438u0440u043eu0432u0430u043du0438u00a0 containing u043cu0438u043au0440u043eu0436u0438u0434u043au043eu0441u0442u043du043eu0435 device having a first plate and a second plate, and the p u0435u0440u0432u0430u00a0 plate has a first surface and a second surface, the first surface has u043fu0435u0440u0432u0430u00a0 contour and the second contour u0442u0440u0430u043du0441u043fu043e u0442u0440u0430u043du0441u043fu043eu0440u0442u0438u0440u043eu0432u0430u043du0438u00a0 fluid u0440u0442u0438u0440u043eu0432u0430u043du0438u00a0 liquid made by herwith the first and second paths u0442u0440u0430u043du0441u043fu043eu0440u0442u0438u0440u043eu0432u0430u043du0438u00a0 fluid u043du0430u0445u043eu0434u00a0u0442u0441u00a0 in thermal contact, and u0432u0442u043eu0440u0430u00a0 plate is adjacent to the first surface of the first place tina.;9. u0442u0435u043fu043bu043eu043eu0431u043cu0435u043du043du0430u00a0 system u0441u043eu0434u0435u0440u0436u0430u0449u0430u00a0 device comprising the u0442u0435u0447u0435u043du0438u00a0 fluid; a first circuit u0442u0435u0447u0435u043du0438u00a0 fluid u043du0430u0445u043eu0434u00a0u0449u0438u0439u0441u00a0 in the device; and a second circuit implementation u043du0438u00a0 fluid in thermal contact with the first circuit u0442u0435u0447u0435u043du0438u00a0 fluid, resulting in the fluid attached to the second temperature of the first circuit.;10. u0442u0435u043fu043bu043eu043eu0431u043cu0435u043du043du0430u00a0 system p.9, in which the second circuit u0442u0435u0447u0435u043du0438u00a0 fluid contains a continuous current of fluid.