Electronic structural component, has two electronic circuits directly bonded with pins and arranged on single lead frame on which two areas are designed, where one area is thermally isolated from other area by heat circumstances

摘要

The component has a lead frame system (3), which is formed at electrical connection pins (4). Two electronic circuits (27, 28) are directly bonded with the pins, where the circuits deliver different electrical power dissipation to their surrounding area. The circuits are arranged on a single lead frame on which two areas (7, 8) are formed. The area (7) is thermally isolated from the area (8) by heat circumstances. An independent claim is also included for a method for manufacturing an electronic structural component.