Wafer grinding method for manufacture of integrated circuit, involves interposing shock absorbing material between wheel mounting and wheel base of grinding stone

摘要

A shock absorbing material (220) e.g. rubber sheet is interposed between the wheel mounting (210) and wheel base (230a) of grinding stone (230), and chuck (14a) mounted with wafer (W1) is rotated. The grinding stone portion (230b) of the grinding stone rotated by motor through spindle (200), is contacted with the wafer to grind the wafer. An independent claim is also included for wafer grinding stone.