Conducting thermo sublimation transfer involves temperature of fixing device remaining below required sublimation transfer temperature of 200 to 300 degrees Celsius during sublimation transfer

摘要

The method involves thermo sublimation transfer between an intermediate support with a printed sublimation ink coating and a substrate that receives the sublimated ink, whereby a fixing device is provided for fixing the intermediate support to the substrate during the sublimation transfer. The temperature of the fixing device remains below the required sublimation transfer of 200 to 300 degrees Celsius during the sublimation transfer. An independent claim is also included for the following: (A) a device for conducting thermo sublimation transfer (B) and a method of reversibly fixing an intermediate support with a printed sublimation ink coating and a substrate.