A device with two micromechanical substrates for a micromechanical system or part of a micromechanical system and method for the composition of two micromechanical substrates

摘要

The invention relates to a device comprising a first substrate and a second substrate intended to form a microsystem such as a sensor, at least one of the substrates can comprise elements of the electronic circuit. & br / & this device is characterized in that a layer of polymer is interposed between the first and second substrate, in that the polymer layer comprises at least one cavity, which extends from the first to the second substrate and in that the connection means, by welding are provided in the cavity, said means of welding providing a mechanical link resistant in tension between the two substrates.