首页> 外国专利> EPITAXIAL WAFER, ELECTRONIC DEVICE, AND VAPOR PHASE EPITAXIAL GROWTH METHOD OF III-V COMPOUND SEMICONDUCTOR CRYSTAL

EPITAXIAL WAFER, ELECTRONIC DEVICE, AND VAPOR PHASE EPITAXIAL GROWTH METHOD OF III-V COMPOUND SEMICONDUCTOR CRYSTAL

机译:III-V复合半导体晶体的表观晶圆,电子器件和气相相表观生长方法

摘要

PROBLEM TO BE SOLVED: To provide an epitaxial wafer, an electronic device and a vapor phase epitaxial growth method of a III-V compound semiconductor crystal allowing an etching stopper layer using an InGaP crystal, of the epitaxial wafer having the epitaxial stopper layer to be thinner than 5 nm and capable of etching stop on the surface of the InGaP layer by selective etching even after thinning of the film.;SOLUTION: An epitaxial wafer of the present invention is provided with an epitaxial layer 2 of a III-V compound semiconductor crystal on a semi-insulating compound semiconductor substrate 1, and the epitaxial layer 2 has an etching stopper layer. The etching stopper layer is formed of an InGaP mixed crystal layer 3 in a crystallized state with an irregular structure.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种III-V族化合物半导体晶体的外延晶片,电子器件和气相外延生长方法,该III-V族化合物半导体晶体允许具有InGaP晶体的外延晶片的蚀刻停止层用作InGaP晶体,厚度小于5nm,并且即使在薄膜变薄之后也能够通过选择性蚀刻而在InGaP层的表面上停止蚀刻。;解决方案:本发明的外延晶片设置有III-V族化合物半导体的外延层2在半绝缘化合物半导体衬底1上形成一个晶体,并且外延层2具有蚀刻停止层。蚀刻停止层由处于结晶状态且具有不规则结构的InGaP混合晶体层3形成。;版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2007235062A

    专利类型

  • 公开/公告日2007-09-13

    原文格式PDF

  • 申请/专利权人 HITACHI CABLE LTD;

    申请/专利号JP20060058203

  • 发明设计人 FUJIKAWA KAZUNARI;ISONO RYOTA;

    申请日2006-03-03

  • 分类号H01L29/812;H01L29/778;H01L21/338;H01L21/205;H01L21/331;H01L29/737;H01L29/201;H01L29/205;

  • 国家 JP

  • 入库时间 2022-08-21 21:16:05

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