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Manufacturing method of a thin film bulk acoustic wave resonator and thin film bulk wave acoustic resonator

机译:薄膜体声波谐振器的制造方法及薄膜体声波谐振器

摘要

A film bulk acoustic resonator, includes first to fourth insulator patterns disposed apart from each other. The third and fourth insulator patterns are disposed opposite the second and first insulator patterns in relation to the first and second insulating patterns, respectively. A bottom conductive layer is disposed above the first and third insulator patterns spreading from a region between the first and second insulator patterns to the third insulator pattern. A piezoelectric film is provided on the bottom conductive layer, disposed above the region between the first and second insulating patterns. A top conductive layer is facing the bottom conductive layer so as to sandwich the piezoelectric film, spreading from the region between the first and second insulator patterns to the fourth insulator pattern.
机译:薄膜压电谐振器包括彼此分开设置的第一至第四绝缘体图案。第三绝缘体图案和第四绝缘体图案相对于第一绝缘体图案和第二绝缘体图案分别与第二绝缘体图案和第二绝缘体图案相对。底部导电层设置在第一绝缘体图案和第三绝缘体图案上方,从第一绝缘体图案和第二绝缘体图案之间的区域扩展到第三绝缘体图案。压电膜设置在底部导电层上,设置在第一绝缘图案和第二绝缘图案之间的区域上方。顶部导电层面对底部导电层,从而将压电膜夹在中间,从第一绝缘体图案和第二绝缘体图案之间的区域扩展到第四绝缘体图案。

著录项

  • 公开/公告号JP3944161B2

    专利类型

  • 公开/公告日2007-07-11

    原文格式PDF

  • 申请/专利权人 株式会社東芝;

    申请/专利号JP20030431235

  • 申请日2003-12-25

  • 分类号H03H9/17;H01L41/09;H01L41/187;H01L41/18;H01L41/22;H03H3/02;

  • 国家 JP

  • 入库时间 2022-08-21 21:10:53

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