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Manufacturing system and apparatus for a balanced manufacturing flow with application to low stress underfill in flip chip electronic devices
Manufacturing system and apparatus for a balanced manufacturing flow with application to low stress underfill in flip chip electronic devices
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机译:用于平衡制造流程的制造系统和设备,适用于倒装芯片电子设备中的低应力底部填充
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摘要
A system ( 100 ) for manufacturing product, in which a first work station ( 101 ) is operable to perform a first manufacturing action on the product parts; this first station has a first entrance ( 101 a) and a first exit 101 b). A second work station ( 102 ) is operable to perform a second manufacturing action on the product parts; this second station has a second entrance ( 102 a) and a second exit ( 102 b). A transport line ( 103 ) between the first exit and the second entrance is operable to move the product parts under computer control. A chamber ( 104 ) encloses a portion of the line and is constructed so that the transport achieves a balanced throughput from the first station to the second station, while the product parts are exposed to computer-controlled environmental conditions ( 110 ) during transport through the chamber. The balanced throughput in the chamber is achieved by waiting lines for the product with computer-controlled monitors ( 105 a) for product parts' positions and times in the chamber.
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