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The thickness of the thin film layers on thin film magnetic disks and the silicon wafer, the reflectivity, the system and method for measuring roughness, surface profile and magnetic pattern simultaneously
The thickness of the thin film layers on thin film magnetic disks and the silicon wafer, the reflectivity, the system and method for measuring roughness, surface profile and magnetic pattern simultaneously
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机译:薄膜磁盘和硅晶片上的薄膜层的厚度,反射率,同时测量粗糙度,表面轮廓和磁性图案的系统和方法
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摘要
(57) in stomach at various angles is not a Brewster angle substantially protective layer consisting SUMMARY thin film, the magnetic imaging, optical contouring, and lubricant thickness of the silicon wafer surface and a thin film magnetic disk and systems and methods for performing the assay lubricant degradation, carbon wear, carbon thickness, the surface roughness. Optical light that can be switched between the S-polarized light-polarizing properties or with P is focused is incident at an angle to the surface of the thin film magnetic disk. This change in the lubricant thickness due to the interaction of the thin film head, the absolute lubricant thickness and degradation of the lubricant can be easily measured. In addition, changes in the absolute thickness and the carbon-carbon thickness can also be measured according to this. Can be also measured surface roughness. The present invention also can be measured curvature of a silicon wafer polished by chemical mechanical polishing (CMP) process, and wear. The surface roughness can be measured at any angle described above. Kerr effect can be identified by measuring the rotation of the reflected light polarized.
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