The resin composition and discrete semiconductor sealing arrangement null for discrete semiconductor seal

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for sealing suitable for transfer molding of a package having a large thickness ratio of the surface to the back surface and the like and good in filling properties and workability and to provide a sealed semiconductor device. ;SOLUTION: This sealing resin composition comprises, as essential ingredients, a thermosetting resin (A), a polar solvent (B) and a silica filler (C), and the silica filler (C) has a maximum particle size of not more than 200 μm and an average particle size of at least 25 μm and not more than 50 μm and is contained in an amount of 300-600 pts.wt. based on 100 pts.wt. of the thermosetting resin (A). The sealed semiconductor device is obtained by sealing a semiconductor chip with a cured product of this resin composition for sealing.;COPYRIGHT: (C)2000,JPO