首页> 外国专利> EXTENDED RAISED SOURCE/DRAIN STRUCTURE FOR ENHANCED CONTACT AREA AND METHOD FOR FORMING EXTENDED RAISED SOURCE/DRAIN STRUCTURE

EXTENDED RAISED SOURCE/DRAIN STRUCTURE FOR ENHANCED CONTACT AREA AND METHOD FOR FORMING EXTENDED RAISED SOURCE/DRAIN STRUCTURE

机译:用于增强接触面积的扩展凸起源/排水结构和形成扩展凸起源/排水结构的方法

摘要

A semiconductor device comprises a gate electrode stack having sidewalls and a top surface with a gate dielectric layer and the gate electrode, and LDD/LDS regions in the substrate aligned with the stack. Conformal L-shaped etch-stop layers with a thickness from about 50 Å to about 200 Å are formed with a vertical leg on the sidewalls of the stack and a horizontal leg reaching over the LDD/LDS regions next to the stack. RSD regions are formed in contact with the substrate aside from the etch-stop layers. The RSD regions cover the horizontal leg of the etch-stop layer and cover at least a portion of the vertical leg of the etch-stop layer on the sidewall of the gate electrode.
机译:半导体器件包括:栅电极叠层,其具有侧壁和具有栅介电层和栅电极的顶表面;以及衬底中的LDD / LDS区域,与该叠层对准。形成厚度为约50埃至约200埃的共形L形蚀刻停止层,在堆叠的侧壁上具有竖直脚,并且在堆叠旁边的LDD / LDS区域上延伸有水平脚。除了蚀刻停止层之外,RSD区域形成为与基板接触。 RSD区域覆盖蚀刻停止层的水平分支并且覆盖在栅电极的侧壁上的蚀刻停止层的垂直分支的至少一部分。

著录项

  • 公开/公告号US2007194387A1

    专利类型

  • 公开/公告日2007-08-23

    原文格式PDF

  • 申请/专利权人 THOMAS W. DYER;SUNFEI FANG;

    申请/专利号US20060307759

  • 发明设计人 THOMAS W. DYER;SUNFEI FANG;

    申请日2006-02-21

  • 分类号H01L29/94;H01L29/76;H01L31/00;

  • 国家 US

  • 入库时间 2022-08-21 21:06:39

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