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Package having balls designed to reduce contact resistance, test apparatus for testing the package, and method of manufacturing the package
Package having balls designed to reduce contact resistance, test apparatus for testing the package, and method of manufacturing the package
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机译:具有减小接触电阻的滚珠的包装,用于测试该包装的测试设备以及该包装的制造方法
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摘要
Provided are an integrated circuit (IC) package having balls designed to minimize contact resistance, a test apparatus for testing the IC package, and a method of manufacturing the IC package. The IC package is a ball grid array (BGA) package including solder balls, the solder balls having substantially flat bottoms. The balls of the BGA package are Pb-free balls, and are polished using a mechanical polishing method or a chemical polishing method to have the substantially flat bottoms. The test apparatus includes a plurality of channels, a test board having a wiring pattern connected to the channels, and an IC socket having a plurality of Pogo pins respectively connected to lands of the wiring pattern. The top ends of the Pogo pins of the IC socket are made substantially flat to increase the area that contacts the substantially flat bottom surfaces of the BGA package.
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